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CY7C1364C
9-Mbit (256K x 32) Pipelined Sync SRAM
Features
* Registered inputs and outputs for pipelined operation * 256K x 32 common I/O architecture * 3.3V core power supply (VDD) * 2.5V/3.3V I/O power supply (VDDQ) * Fast clock-to-output times -- 2.8 ns (for 250-MHz device) * Provide high-performance 3-1-1-1 access rate * User-selectable burst counter supporting Intel(R) Pentium(R) interleaved or linear burst sequences * Separate processor and controller address strobes * Synchronous self-timed writes * Asynchronous output enable * Available in JEDEC-standard lead-free 100-Pin TQFP package * TQFP Available with 3-Chip Enable and 2-Chip Enable * "ZZ" Sleep Mode Option
Functional Description[1]
The CY7C1364C SRAM integrates 256K x 32 SRAM cells with advanced synchronous peripheral circuitry and a two-bit counter for internal burst operation. All synchronous inputs are gated by registers controlled by a positive-edge-triggered Clock Input (CLK). The synchronous inputs include all addresses, all data inputs, address-pipelining Chip Enable (CE1), depth-expansion Chip Enables (CE2 and CE3[2]), Burst Control inputs (ADSC, ADSP, and ADV), Write Enables (BW[A:D], and BWE), and Global Write (GW). Asynchronous inputs include the Output Enable (OE) and the ZZ pin. Addresses and chip enables are registered at rising edge of clock when either Address Strobe Processor (ADSP) or Address Strobe Controller (ADSC) are active. Subsequent burst addresses can be internally generated as controlled by the Advance pin (ADV). Address, data inputs, and write controls are registered on-chip to initiate a self-timed Write cycle.This part supports Byte Write operations (see Pin Descriptions and Truth Table for further details). Write cycles can be one to four bytes wide as controlled by the Byte Write control inputs. GW when active LOW causes all bytes to be written. The CY7C1364C operates from a +3.3V core power supply while all outputs may operate with either a +2.5 or +3.3V supply. All inputs and outputs are JEDEC-standard JESD8-5-compatible.
Logic Block Diagram-CY7C1364C (256K x 32)
A0, A1, A
ADDRESS REGISTER
2
A[1:0]
MODE ADV CLK
Q1
ADSC ADSP
BWD DQD BYTE WRITE REGISTER DQC BYTE WRITE REGISTER DQB BYTE WRITE REGISTER DQA BYTE WRITE REGISTER
BURST COUNTER CLR AND Q0 LOGIC
DQD BYTE WRITE DRIVER DQC BYTE WRITE DRIVER DQB BYTE WRITE DRIVER DQA BYTE WRITE DRIVER
BWC
MEMORY ARRAY
SENSE AMPS
OUTPUT REGISTERS
OUTPUT BUFFERS E
DQs
BWB
BWA BWE
GW CE1 CE2 CE3 OE
ENABLE REGISTER
PIPELINED ENABLE
INPUT REGISTERS
ZZ
SLEEP CONTROL
Notes: 1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com. 2. CE3 is not available on 2 Chip Enable TQFP package.
Cypress Semiconductor Corporation Document #: 38-05689 Rev. *E
*
198 Champion Court
*
San Jose, CA 95134-1709 * 408-943-2600 Revised September 14, 2006
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CY7C1364C
Selection Guide
250 MHz Maximum Access Time Maximum Operating Current Maximum CMOS Standby Current 2.8 250 40 200 MHz 3.0 220 40 166 MHz 3.5 180 40 Unit ns mA mA
Pin Configuration
100-Pin TQFP Pinout (2 Chip Enables) (AJ version)
A A CE1 CE2 BWD BWC BWB BWA A VDD VSS CLK GW BWE OE ADSC ADSP ADV A A NC DQC DQC VDDQ VSSQ DQC DQC DQC DQC VSSQ VDDQ DQC DQC NC VDD NC VSS DQD DQD VDDQ VSSQ DQD DQD DQD DQD VSSQ VDDQ DQD DQD NC 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
BYTE C
BYTE D
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
CY7C1364C
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
NC DQB DQB VDDQ VSSQ DQB DQB DQB DQB VSSQ VDDQ DQB DQB VSS NC VDD ZZ DQA DQA VDDQ VSSQ DQA DQA DQA DQA VSSQ VDDQ DQA DQA NC
BYTE B
BYTE A
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MODE A A A A A1 A0 NC NC VSS VDD NC NC A A A A A A A
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
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CY7C1364C
Pin Configuration (continued)
100-Pin TQFP Pinout (3 Chip Enables) (A version)
A A CE1 CE2 BWD BWC BWB BWA CE3 VDD VSS CLK GW BWE OE ADSC ADSP ADV A A NC DQC DQC VDDQ VSSQ DQC DQC DQC DQC VSSQ VDDQ DQC DQC NC VDD NC VSS DQD DQD VDDQ VSSQ DQD DQD DQD DQD VSSQ VDDQ DQD DQD NC 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
BYTE C
BYTE D
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
CY7C1364C
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
NC DQB DQB VDDQ VSSQ DQB DQB DQB DQB VSSQ VDDQ DQB DQB VSS NC VDD ZZ DQA DQA VDDQ VSSQ DQA DQA DQA DQA VSSQ VDDQ DQA DQA NC
BYTE B
BYTE A
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MODE A A A A A1 A0 NC NC VSS VDD NC A A A A A A A A
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
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CY7C1364C
Pin Definitions
Name A0, A1, A TQFP 37, 36, 32, 33, 34, 35, 43, 44, 45, 46, 47, 48, 49, 50, 81, 82, 99, 100 93, 94, 95, 96 88 I/O Description InputAddress Inputs used to select one of the 256K address locations. Synchronous Sampled at the rising edge of the CLK if ADSP or ADSC is active LOW, and CE1, CE2, and CE3 are sampled active. A[1:0] feed the 2-bit counter. InputByte Write Select Inputs, active LOW. Qualified with BWE to conduct Synchronous byte writes to the SRAM. Sampled on the rising edge of CLK. InputGlobal Write Enable Input, active LOW. When asserted LOW on the Synchronous rising edge of CLK, a global Write is conducted (ALL bytes are written, regardless of the values on BW[A:D] and BWE). InputByte Write Enable Input, active LOW. Sampled on the rising edge of Synchronous CLK. This signal must be asserted LOW to conduct a Byte Write. InputClock Clock Input. Used to capture all synchronous inputs to the device. Also used to increment the burst counter when ADV is asserted LOW, during a burst operation.
BWA, BWB BWC, BWD GW
BWE CLK
87 89
CE1
98
InputChip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Synchronous Used in conjunction with CE2 and CE3 to select/deselect the device. ADSP is ignored if CE1 is HIGH. CE1 is sampled only when a new external address is loaded. InputChip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Synchronous Used in conjunction with CE1 and CE3 to select/deselect the device. CE2 is sampled only when a new external address is loaded.
CE2
97
CE3
92 InputChip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. (for 3 Chip Enable Version) Synchronous Used in conjunction with CE1 and CE2 to select/deselect the device.CE3 is assumed active throughout this document for BGA. CE3 is sampled only when a new external address is loaded. 86 InputOutput Enable, asynchronous input, active LOW. Controls the Asynchronous direction of the I/O pins. When LOW, the I/O pins behave as outputs. When deasserted HIGH, I/O pins are tri-stated, and act as input data pins. OE is masked during the first clock of a Read cycle when emerging from a deselected state. InputAdvance Input signal, sampled on the rising edge of CLK, active Synchronous LOW. When asserted, it automatically increments the address in a burst cycle. InputAddress Strobe from Processor, sampled on the rising edge of Synchronous CLK, active LOW. When asserted LOW, A is captured in the address registers. A[1:0] are also loaded into the burst counter. When ADSP and ADSC are both asserted, only ADSP is recognized. ASDP is ignored when CE1 is deasserted HIGH. InputAddress Strobe from Controller, sampled on the rising edge of Synchronous CLK, active LOW. When asserted LOW, A is captured in the address registers. A[1:0] are also loaded into the burst counter. When ADSP and ADSC are both asserted, only ADSP is recognized. InputZZ "sleep" Input, active HIGH. This input, when High places the Asynchronous device in a non-time-critical "sleep" condition with data integrity preserved. For normal operation, this pin has to be LOW or left floating. ZZ pin has an internal pull-down. I/OBidirectional Data I/O lines. As inputs, they feed into an on-chip data Synchronous register that is triggered by the rising edge of CLK. As outputs, they deliver the data contained in the memory location specified by "A" during the previous clock rise of the Read cycle. The direction of the pins is controlled by OE. When OE is asserted LOW, the pins behave as outputs. When HIGH, DQ are placed in a tri-state condition. Power Supply Power supply inputs to the core of the device. Ground Ground for the core of the device.
OE
ADV
83
ADSP
84
ADSC
85
ZZ
64
DQs
52, 53, 56, 57, 58, 59, 62, 63, 68, 69, 72, 73, 74, 75, 78, 79, 2, 3, 6, 7, 8, 9, 12, 13, 18, 19, 22, 23, 24, 25, 28, 29 15, 41, 65, 91 17, 40, 67, 90
VDD VSS
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CY7C1364C
Pin Definitions (continued)
Name VDDQ VSSQ MODE TQFP 4, 11, 20, 27, 54, 61, 70, 77 5, 10, 21, 26, 55, 60, 71, 76 31 I/O I/O Power Supply I/O Ground InputStatic Description Power supply for the I/O circuitry. Ground for the I/O circuitry. Selects Burst Order. When tied to GND selects linear burst sequence. When tied to VDD or left floating selects interleaved burst sequence. This is a strap pin and should remain static during device operation. Mode pin has an internal pull-up. No Connects. Not internally connected to the die Single Write Accesses Initiated by ADSP This access is initiated when both of the following conditions are satisfied at clock rise: (1) ADSP is asserted LOW, and (2) CE1, CE2, CE3 are all asserted active. The address presented to A is loaded into the address register and the address advancement logic while being delivered to the RAM array. The Write signals (GW, BWE, and BW[A:D]) and ADV inputs are ignored during this first cycle. ADSP-triggered Write accesses require two clock cycles to complete. If GW is asserted LOW on the second clock rise, the data presented to the DQ inputs is written into the corresponding address location in the memory array. If GW is HIGH, then the Write operation is controlled by BWE and BW[A:D] signals. The CY7C1364C provides Byte Write capability that is described in the Write Cycle Descriptions table. Asserting the Byte Write Enable input (BWE) with the selected Byte Write (BW[A:D]) input, will selectively write to only the desired bytes. Bytes not selected during a Byte Write operation will remain unaltered. A synchronous self-timed Write mechanism has been provided to simplify the Write operations. Because the CY7C1364C is a common I/O device, the Output Enable (OE) must be deasserted HIGH before presenting data to the DQ inputs. Doing so will tri-state the output drivers. As a safety precaution, DQ are automatically tri-stated whenever a Write cycle is detected, regardless of the state of OE. Single Write Accesses Initiated by ADSC ADSC Write accesses are initiated when the following conditions are satisfied: (1) ADSC is asserted LOW, (2) ADSP is deasserted HIGH, (3) CE1, CE2, CE3 are all asserted active, and (4) the appropriate combination of the Write inputs (GW, BWE, and BW[A:D]) are asserted active to conduct a Write to the desired byte(s). ADSC-triggered Write accesses require a single clock cycle to complete. The address presented to A is loaded into the address register and the address advancement logic while being delivered to the memory array. The ADV input is ignored during this cycle. If a global Write is conducted, the data presented to the DQ is written into the corresponding address location in the memory core. If a Byte Write is conducted, only the selected bytes are written. Bytes not selected during a Byte Write operation will remain unaltered. A synchronous self-timed Write mechanism has been provided to simplify the Write operations. Because the CY7C1364C is a common I/O device, the Output Enable (OE) must be deasserted HIGH before presenting data to the DQ inputs. Doing so will tri-state the output drivers. As a safety precaution, DQs are automatically tri-stated whenever a Write cycle is detected, regardless of the state of OE. Page 5 of 18
NC
1, 14, 16, 30, 38, 39, 42, 51, 66, 80
Functional Overview
All synchronous inputs pass through input registers controlled by the rising edge of the clock. All data outputs pass through output registers controlled by the rising edge of the clock. The CY7C1364C supports secondary cache in systems utilizing either a linear or interleaved burst sequence. The interleaved burst order supports Pentium and i486TM processors. The linear burst sequence is suited for processors that utilize a linear burst sequence. The burst order is user selectable, and is determined by sampling the MODE input. Accesses can be initiated with either the Processor Address Strobe (ADSP) or the Controller Address Strobe (ADSC). Address advancement through the burst sequence is controlled by the ADV input. A two-bit on-chip wraparound burst counter captures the first address in a burst sequence and automatically increments the address for the rest of the burst access. Byte Write operations are qualified with the Byte Write Enable (BWE) and Byte Write Select (BW[A:D]) inputs. A Global Write Enable (GW) overrides all Byte Write inputs and writes data to all four bytes. All writes are simplified with on-chip synchronous self-timed Write circuitry. Three synchronous Chip Selects (CE1, CE2, CE3) and an asynchronous Output Enable (OE) provide for easy bank selection and output tri-state control. ADSP is ignored if CE1 is HIGH. Single Read Accesses This access is initiated when the following conditions are satisfied at clock rise: (1) ADSP or ADSC is asserted LOW, (2) CE1, CE2, CE3 are all asserted active, and (3) the Write signals (GW, BWE) are all deasserted HIGH. ADSP is ignored if CE1 is HIGH. The address presented to the address inputs (A) is stored into the address advancement logic and the address register while being presented to the memory array. The corresponding data is allowed to propagate to the input of the output registers. At the rising edge of the next clock the data is allowed to propagate through the output register and onto the data bus within tCO if OE is active LOW. The only exception occurs when the SRAM is emerging from a deselected state to a selected state, its outputs are always tri-stated during the first cycle of the access. After the first cycle of the access, the outputs are controlled by the OE signal. Consecutive single Read cycles are supported. Once the SRAM is deselected at clock rise by the chip select and either ADSP or ADSC signals, its output will tri-state immediately.
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CY7C1364C
Burst Sequences
The CY7C1364C provides a two-bit wraparound counter, fed by A[1:0], that implements either an interleaved or linear burst sequence. The interleaved burst sequence is designed specifically to support Intel Pentium applications. The linear burst sequence is designed to support processors that follow a linear burst sequence. The burst sequence is user selectable through the MODE input. Asserting ADV LOW at clock rise will automatically increment the burst counter to the next address in the burst sequence. Both Read and Write burst operations are supported.
Interleaved Burst Address Table (MODE = Floating or VDD)
First Address A[1:0] 00 01 10 11 Second Address A[1:0] 01 00 11 10 Third Address A[1:0] 10 11 00 01 Fourth Address A[1:0] 11 10 01 00
Sleep Mode
The ZZ input pin is an asynchronous input. Asserting ZZ places the SRAM in a power conservation "sleep" mode. Two clock cycles are required to enter into or exit from this "sleep" mode. While in this mode, data integrity is guaranteed. Accesses pending when entering the "sleep" mode are not considered valid nor is the completion of the operation guaranteed. The device must be deselected prior to entering the "sleep" mode. CE1, CE2, CE3, ADSP, and ADSC must remain inactive for the duration of tZZREC after the ZZ input returns LOW.
Linear Burst Address Table (MODE = GND)
First Address A[1:0] 00 01 10 11 Second Address A[1:0] 01 10 11 00 Third Address A[1:0] 10 11 00 01 Fourth Address A[1:0] 11 00 01 10
ZZ Mode Electrical Characteristics
Parameter IDDZZ tZZS tZZREC tZZI tRZZI Description Sleep mode standby current Device operation to ZZ ZZ recovery time ZZ Active to Sleep current ZZ Inactive to exit Sleep current Test Conditions ZZ > VDD - 0.2V ZZ > VDD - 0.2V ZZ < 0.2V This parameter is sampled This parameter is sampled 0 2tCYC 2tCYC Min. Max. 50 2tCYC Unit mA ns ns ns ns
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CY7C1364C
Truth Table[3, 4, 5, 6, 7, 8]
Next Cycle Unselected Unselected Unselected Unselected Unselected Begin Read Begin Read Continue Read Continue Read Continue Read Continue Read Suspend Read Suspend Read Suspend Read Suspend Read Begin Write Begin Write Begin Write Continue Write Continue Write Suspend Write Suspend Write ZZ "Sleep" Address Used None None None None None External External Next Next Next Next Current Current Current Current Current Current External Next Next Current Current None ZZ L L L L L L L L L L L L L L L L L L L L L L H CE3 X H X H X L L X X X X X X X X X X L X X X X X CE2 X X L X L H H X X X X X X X X X X H X X X X X CE1 H L L L L L L X X H H X X H H X H L X H X H X ADSP X L L H H L H H H X X H H X X H X H H X H X X ADSC L X X L L X L H H H H H H H H H H H H H H H X ADV X X X X X X X L L L L H H H H H H X H H H H X OE X X X X X X X H L H L H L H L X X X X X X X X DQ Tri-State Tri-State Tri-State Tri-State Tri-State Tri-State Tri-State Tri-State DQ Tri-State DQ Tri-State DQ Tri-State DQ Tri-State Tri-State Tri-State Tri-State Tri-State Tri-State Tri-State Tri-State Write X X X X X X Read Read Read Read Read Read Read Read Read Write Write Write Write Write Write Write X
Notes: 3. X = "Don't Care." H = Logic HIGH, L = Logic LOW. 4. WRITE = L when any one or more Byte Write Enable signals (BWA,BWB,BWC,BWD) and BWE = L or GW = L. WRITE = H when all Byte Write Enable signals (BWA,BWB,BWC,BWD), BWE, GW = H. 5. The DQ pins are controlled by the current cycle and the OE signal. OE is asynchronous and is not sampled with the clock. 6. CE1, CE2, and CE3 are available only in the TQFP package. 7. The SRAM always initiates a Read cycle when ADSP is asserted, regardless of the state of GW, BWE, or BW[A:D]. Writes may occur only on subsequent clocks after the ADSP or with the assertion of ADSC. As a result, OE must be driven HIGH prior to the start of the Write cycle to allow the outputs to tri-state. OE is a don't care for the remainder of the Write cycle. 8. OE is asynchronous and is not sampled with the clock rise. It is masked internally during Write cycles. During a Read cycle all data bits are tri-state when OE is inactive or when the device is deselected, and all data bits behave as output when OE is active (LOW).
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CY7C1364C
Truth Table for Read/Write[3, 4]
Function Read Read Write Byte A - DQA Write Byte B - DQB Write Bytes B, A Write Byte C - DQC Write Bytes C, A Write Bytes C, B Write Bytes C, B, A Write Byte D - DQD Write Bytes D, A Write Bytes D, B Write Bytes D, B, A Write Bytes D, C Write Bytes D, C, A Write Bytes D, C, B Write All Bytes Write All Bytes GW H H H H H H H H H H H H H H H H H L BWE H L L L L L L L L L L L L L L L L X BWD X H H H H H H H H L L L L L L L L X BWC X H H H H L L L L H H H H L L L L X BWB X H H L L H H L L H H L L H H L L X BWA X H L H L H L H L H L H L H L H L X
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CY7C1364C
Maximum Ratings
(Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature ................................. -65C to +150C Ambient Temperature with Power Applied ............................................ -55C to +125C Supply Voltage on VDD Relative to GND ........-0.5V to +4.6V Supply Voltage on VDDQ Relative to GND...... -0.5V to +VDD DC Voltage Applied to Outputs in tri-state.............................................-0.5V to VDDQ + 0.5V Range Commercial Industrial DC Input Voltage ................................... -0.5V to VDD + 0.5V Current into Outputs (LOW) .........................................20 mA Static Discharge Voltage .......................................... >2001V (per MIL-STD-883, Method 3015) Latch-up Current ..................................................... >200 mA
Operating Range
Ambient Temperature 0C to +70C -40C to +85C VDD 3.3V - 5%/+10% VDDQ 2.5V - 5% to VDD
Electrical Characteristics Over the Operating Range [9, 10]
Parameter Description VDD Power Supply Voltage VDDQ VOH VOL VIH VIL IX I/O Supply Voltage Output HIGH Voltage Output LOW Voltage Input HIGH Voltage[9] Input LOW Voltage[9] Input Leakage Current except ZZ and MODE for 3.3 V I/O for 2.5V I/O for 3.3 V I/O, IOH = -4.0 mA for 2.5V I/O, IOH = -1.0 mA for 3.3 V I/O, IOL = 8.0 mA for 2.5V I/O, IOL = 1.0 mA for 3.3 V I/O for 2.5V I/O for 3.3 V I/O for 2.5V I/O GND VI VDDQ 2.0 1.7 -0.3 -0.3 -5 -30 5 -5 30 -5 5 250 220 180 130 120 110 40 mA 4-ns cycle, 250 MHz 5-ns cycle, 200 MHz 6-ns cycle, 166 MHz ISB1 Automatic CE Power-down Current--TTL Inputs VDD = Max., Device Deselected, 4-ns cycle, 250 MHz VIN VIH or VIN VIL, 5-ns cycle, 200 MHz f = fMAX = 1/tCYC 6-ns cycle, 166 MHz Test Conditions Min. 3.135 3.135 2.375 2.4 2.0 0.4 0.4 VDD + 0.3V VDD + 0.3V 0.8 0.7 5 Max. 3.6 VDD 2.625 Unit V V V V V V V V V V V A A A A A A mA mA mA mA
Input Current of MODE Input = VSS Input = VDD Input Current of ZZ IOZ IDD Input = VSS Input = VDD Output Leakage Current GND VI VDDQ, Output Disabled VDD Operating Supply Current VDD = Max., IOUT = 0 mA, f = fMAX = 1/tCYC
ISB2
Automatic CE VDD = Max., Device Deselected, All speeds Power-down VIN 0.3V or VIN > VDDQ - 0.3V, Current--CMOS Inputs f = 0 Automatic CE VDD = Max., Device Deselected, 4-ns cycle, 250 MHz Power-down or VIN 0.3V or VIN > VDDQ - 0.3V, 5-ns cycle, 200 MHz Current--CMOS Inputs f = fMAX = 1/tCYC 6-ns cycle, 166 MHz Automatic CE Power-down Current--TTL Inputs VDD = Max., Device Deselected, All speeds VIN VIH or VIN VIL, f=0
ISB3
120 110 100 40
mA
ISB4
mA
Notes: 9. Overshoot: VIH(AC) < VDD +1.5V (Pulse width less than tCYC/2), undershoot: VIL(AC) > -2V (Pulse width less than tCYC/2). 10. TPower-up: Assumes a linear ramp from 0Vv to VDD(min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD.
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CY7C1364C
Capacitance[11]
Parameter CIN CCLK CI/O Description Input Capacitance Clock Input Capacitance Input/Output Capacitance Test Conditions TA = 25C, f = 1 MHz, VDD = 3.3V VDDQ = 2.5V 100 TQFP Max. 5 5 5 Unit pF pF pF
Thermal Resistance[11]
Parameter JA JC Description Thermal Resistance (Junction to Ambient) Thermal Resistance (Junction to Case) Test Conditions Test conditions follow standard test methods and procedures for measuring thermal impedance, per EIA/JESD51 100 TQFP Package 29.41 6.13 Unit C/W C/W
AC Test Loads and Waveforms
3.3V I/O Test Load
OUTPUT Z0 = 50 3.3V OUTPUT RL = 50 5 pF INCLUDING JIG AND SCOPE 2.5V Z0 = 50 OUTPUT RL = 50 5 pF VT = 1.25V INCLUDING JIG AND SCOPE R =1538 R = 351 R = 317 VDDQ 10% GND 1 ns ALL INPUT PULSES 90% 90% 10% 1 ns
VT = 1.5V (a)
(b)
R = 1667 VDDQ 10% GND 1 ns
(c)
ALL INPUT PULSES 90% 90% 10% 1 ns
2.5V I/O Test Load
OUTPUT
(a)
(b)
(c)
Note: 11. Tested initially and after any design or process change that may affect these parameters
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CY7C1364C
Switching Characteristics Over the Operating Range[12,13]
-250 Parameter tPOWER Clock tCYC tCH tCL Output Times tCO tDOH tCLZ tCHZ tOEV tOELZ tOEHZ Set-up Times tAS tADS tADVS tWES tDS tCES Hold Times tAH tADH tADVH tWEH tDH tCEH Address Hold after CLK Rise ADSP, ADSC Hold after CLK Rise ADV Hold after CLK Rise GW, BWE, BW[A:D] Hold after CLK Rise Data Input Hold after CLK Rise Chip Enable Hold after CLK Rise 0.4 0.4 0.4 0.4 0.4 0.4 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 ns ns ns ns ns ns Address Set-up before CLK Rise ADSC, ADSP Set-up before CLK Rise ADV Set-up before CLK Rise GW, BWE, BW[A:D] Set-up before CLK Rise Data Input Set-up before CLK Rise Chip Enable Set-up before CLK Rise 1.25 1.25 1.25 1.25 1.25 1.25 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 ns ns ns ns ns ns Data Output Valid after CLK Rise Data Output Hold after CLK Rise Clock to Low-Z[15, 16, 17] Clock to High-Z
[15, 16, 17]
-200 Max. Min. 1 5.0 2.0 2.0 2.8 3.0 1.25 1.25 2.8 2.8 1.25 0 2.8 3.0 3.0 3.0 0 Max. 1 6.0 2.4 2.4
-166 Min. Max. Unit ms ns ns ns 3.5 1.25 1.25 1.25 3.5 3.5 3.5 ns ns ns ns ns ns ns
Description VDD(Typical) to the First Access[14] Clock Cycle Time Clock HIGH Clock LOW
Min. 1 4.0 1.8 1.8
1.25 1.25 1.25 0
OE LOW to Output Valid OE LOW to Output Low-Z[15, 16, 17] OE HIGH to Output High-Z[15, 16, 17]
Notes: 12. Timing reference level is 1.5V when VDDQ = 3.3V and is 1.25V when VDDQ = 2.5V. 13. Test conditions shown in (a) of AC Test Loads unless otherwise noted. 14. This part has a voltage regulator internally; tPOWER is the time that the power needs to be supplied above VDD minimum initially before a Read or Write operation can be initiated. 15. tCHZ, tCLZ,tOELZ, and tOEHZ are specified with AC test conditions shown in part (b) of AC Test Loads. Transition is measured 200 mV from steady-state voltage. 16. At any given voltage and temperature, tOEHZ is less than tOELZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve High-Z prior to Low-Z under the same system conditions. 17. This parameter is sampled and not 100% tested.
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CY7C1364C
Switching Waveforms
Read Cycle Timing[18]
t CYC
CLK t CH t t ADS ADH ADSP tADS ADSC tAS A1 tWES tWEH GW, BWE, BW[A:D] tCES tCEH CE tADVS tADVH ADV ADV suspends burst. OE tOEV t OEHZ t CLZ Data Out (Q) High-Z Q(A1) t CO t OELZ tCO tDOH Q(A2) Q(A2 + 1) Q(A2 + 2) Q(A2 + 3) Q(A2) t CHZ Q(A2 + 1) Deselect cycle tAH tADH t CL
ADDRESS
A2
A3 Burst continued with new base address
Burst wraps around Note: to its initial state 18. On this diagram, when CE is LOW, CE1 is LOW, CE2 is HIGH and CE3 is LOW. When CE is HIGH, CE1 is HIGH or CE2 is LOW or CE3 is HIGH.
Document #: 38-05689 Rev. *E
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CY7C1364C
Switching Waveforms (continued)
Write Cycle Timing[18,19]
t CYC
CLK tCH tADS ADSP ADSC extends burst tADS tADH tADH tCL
tADS ADSC tAS A1 tAH
tADH
ADDRESS
A2 Byte write signals are ignored for first cycle when ADSP initiates burst
A3
tWES tWEH
BWE, BW[A :D] tWES tWEH GW tCES CE t t ADVS ADVH ADV ADV suspends burst tCEH
OE tDS tDH
Data In (D)
High-Z
t OEHZ
D(A1)
D(A2)
D(A2 + 1)
D(A2 + 1)
D(A2 + 2)
D(A2 + 3)
D(A3)
D(A3 + 1)
D(A3 + 2)
Data Out (Q) BURST READ Single WRITE BURST WRITE Extended BURST WRITE
DON'T CARE
UNDEFINED
Note: 19. Full width Write can be initiated by either GW LOW; or by GW HIGH, BWE LOW and BW[A:D] LOW.
Document #: 38-05689 Rev. *E
Page 13 of 18
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CY7C1364C
Switching Waveforms (continued)
Read/Write Cycle Timing[18,20, 21]
tCYC
CLK tCH tADS ADSP tADH tCL
ADSC tAS tAH
ADDRESS
A1
A2
A3 tWES tWEH
A4
A5
A6
BWE, BW[A:D] tCES CE tCEH
ADV
OE tCO tDS tDH tOELZ Data In (D) High-Z tCLZ Data Out (Q) High-Z Q(A1) Back-to-Back READs tOEHZ Q(A2) Single WRITE D(A3) D(A5) D(A6)
Q(A4)
Q(A4+1) BURST READ
Q(A4+2)
Q(A4+3) Back-to-Back WRITEs
DON'T CARE
UNDEFINED
Notes: 20. The data bus (Q) remains in High-Z following a Write cycle unless an ADSP, ADSC, or ADV cycle is performed. 21. GW is HIGH.
Document #: 38-05689 Rev. *E
Page 14 of 18
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CY7C1364C
Switching Waveforms (continued)
ZZ Mode Timing[22, 23]
CLK
t ZZ t ZZREC
ZZ
t
ZZI
I
SUPPLY I DDZZ t RZZI DESELECT or READ Only
ALL INPUTS (except ZZ)
Outputs (Q)
High-Z
DON'T CARE
Notes: 22. Device must be deselected when entering ZZ mode. See Cycle Descriptions table for all possible signal conditions to deselect the device. 23. DQs are in High-Z when exiting ZZ sleep mode.
Document #: 38-05689 Rev. *E
Page 15 of 18
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CY7C1364C
Ordering Information
Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit www.cypress.com for actual products offered. Speed (MHz) 166 Ordering Code CY7C1364C-166AXC CY7C1364C-166AJXC CY7C1364C-166AXI CY7C1364C-166AJXI 200 CY7C1364C-200AXC CY7C1364C-200AJXC CY7C1364C-200AXI CY7C1364C-200AJXI 250 CY7C1364C-250AXC CY7C1364C-250AJXC CY7C1364C-250AXI CY7C1364C-250AJXI Package Diagram Part and Package Type Operating Range Commercial
51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free (3 Chip Enable) 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free (2 Chip Enable) 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free (3 Chip Enable) 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free (2 Chip Enable) 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free (3 Chip Enable) 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free (2 Chip Enable) 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free (3 Chip Enable) 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free (2 Chip Enable) 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free (3 Chip Enable) 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free (2 Chip Enable) 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free (3 Chip Enable) 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free (2 Chip Enable)
Industrial
Commercial
Industrial
Commercial
Industrial
Document #: 38-05689 Rev. *E
Page 16 of 18
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CY7C1364C
Package Diagram
100-Pin TQFP (14 x 20 x 1.4 mm) (51-85050)
16.000.20 14.000.10
100 1 81 80
1.400.05
0.300.08
22.000.20
20.000.10
0.65 TYP.
30 31 50 51
121 (8X)
SEE DETAIL
A
0.20 MAX. 1.60 MAX. 0 MIN. SEATING PLANE 0.25 GAUGE PLANE STAND-OFF 0.05 MIN. 0.15 MAX.
NOTE: 1. JEDEC STD REF MS-026 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 3. DIMENSIONS IN MILLIMETERS
0-7
R 0.08 MIN. 0.20 MAX.
0.600.15 0.20 MIN. 1.00 REF.
DETAIL
51-85050-*B
A
i486 is a trademark, and Intel and Pentium are registered trademarks, of Intel Corporation. PowerPC is a registered trademark of IBM Corporation. All product and company names mentioned in this document may be trademarks of their respective holders.
Document #: 38-05689 Rev. *E
0.10
R 0.08 MIN. 0.20 MAX.
Page 17 of 18
(c) Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
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CY7C1364C
Document History Page
Document Title: CY7C1364C 9-Mbit (256K x 32) Pipelined Sync SRAM Document Number: 38-05689 REV. ** *A ECN NO. 286269 320834 Issue Date See ECN See ECN Orig. of Change PCI PCI New data sheet Changed 225 MHz into 250 MHz Changed JA and JC for TQFP from 25 and 9 C/W to 29.41 and 6.13 C/W respectively Modified VOL, VOH test conditions Added Industrial Operating Range Changed Snooze to Sleep in the ZZ Mode Electrical Characteristics Shaded 250 MHz speed bin in the AC/DC table and Selection Guide Added AJXC package in the Ordering Information Updated Ordering Information Table Changed ISB2 from 30 to 40 mA Modified test condition in note# 9 from VIH < VDD to VIH < VDD Changed address of Cypress Semiconductor Corporation on Page# 1 from "3901 North First Street" to "198 Champion Court" Changed three-state to tri-state Converted from Preliminary to Final Modified "Input Load" to "Input Leakage Current except ZZ and MODE" in the Electrical Characteristics Table Replaced Package Name column with Package Diagram in the Ordering Information table Updated the ordering information Added 2.5 V I/O option Included 2 Chip Enable Pinout Updated Ordering Information Table Added the Maximum Rating for Supply Voltage on VDDQ Relative to GND Updated the Ordering Information table. Description of Change
*B *C
377095 408725
See ECN See ECN
PCI RXU
*D
429278
See ECN
NXR
*E
501828
See ECN
VKN
Document #: 38-05689 Rev. *E
Page 18 of 18
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